HARBIN BIMOTEK TECHNOLOGY

Design and manufacturing electronics products


About us

HARBIN BIMOTEK TECHNOLOGY Co., Ltd is dedicated to design and manufacture electronics products. We offer customized turnkey design and manufacturing solution services for customers who want their products to be quality and unique.

We offer OEM contract manufacturing services, product assembly, PC board design, electronic components assembly, contract assembly services. We assembly your metal parts, aluminum parts, plastic parts, electronic components, PC board, battery component all in one service. If you are looking for OEM contract companies, contact us.

Our Mission

Provide the most efficient and highest quality solutions to customers.

Our Vision

Promote and improve quality of human life.

Capabilities

Electronic and Mechanical Engineering

3D printer for prototyping

Programming

  • MCU firmware, XC8, XC16, XC32, C18, C30

  • Hi-Tech PICC-18, ICC AVR, Keli uVision

  • MPLAB IDE, MPLAB X, etc

  • Visual Studio, etc

Ultra precision machining

  • Wafer slicing

  • Grinding

  • Lapping

  • Polishing

PCB layout

Precision assemblies

Real time Web-based quality monitoring system

ESD and corrosion controlled environment (clean room)

Mechanical Design & Modeling

  • Solidworks

  • ProE,

  • Zwcad, etc

Testing

  • In-house electrostatic discharge test

  • Assembly and testing for consumer products

  • Tester design and fabrication for consumer products

  • In-house Tester Development

  • Thermal and humidity cycling and reliability testing

Chemical and applied science

  • Chemical and applied science engineering support

  • Vacuum deposition and sputtering techniques

  • Glass and epoxy bonding

Electronics Design

  • 4/8/12/16/32 bit Micro Controller Unit

  • Analog Circuit, Digital Circuit, RF Circuit

  • Wi-Fi, ZigBee, Z-wave communicating

  • EAGLE, etc

Head-Tape-Interfacing modeling: TapeLab

In-house tool room

Machining, Processing, Assembling and Testing

  • Wafer Slicing Saw, MTI

  • Wafer Slicing Saw, Meyerburger

  • Wafer Scribing Saw, Disco

  • CNC Grinder, Chevalier Smart B818

  • Surface Grinder, Taft

  • Wire Bonding Machine, Westbond

  • Automatic Wire Bonder, Bonda, Palomar

  • High Speed Spin dryer

  • UV Belt Oven, Dymax

  • Plasma Etching Machine, TePla

  • Vacuum deposition and sputtering systems

  • Ultra-precision dual stage radial lapping system

  • Ultra-precision dual spindle flat lapping system

  • Ultra-precision dual stage rough lapping system

  • Tape-polishing machine

  • Inverse surface grinding machine

  • Programmable magnetizing machine

  • Automatic bonding pull force teste

  • Multi-stage high speed run-in machine

  • Automatic tape reel converter

  • Automatic radial surface rework station

  • Equipment status real-time monitoring and alarming system

  • Automatic flat surface rework station

  • Automatic chemical cleaning and spin drying system

  • Automatic multi-axis optical alignment systems

  • Automatic multi-pads resistance probing tester

  • Automatic multi-flex eeprom functional tester

  • Interposer card tester

  • Automatic head signal simulato

  • Automatic flex label and eeprom checker

  • Automatic flex resistance meter

  • Temperature-Humidity cycling chamber, Espec

  • Nitrogen filled curing oven

  • Clean bench

  • Corrosion control cleanroom

  • Temperature humidity control cleanroom

  • UPS for sensitive assembly and testing equipment

  • Power, current, air pressure, temperature and humidity real time monitoring

  • Real-time web-base quality data and statistical control system

  • Tool-maker microscopes, stereo microscopes, projectors

Sourcing with Engineering Support

Components sourcing capabilities:

  • Metal in molding components

  • Die casting components

  • Plastic injection components

  • Metal stamping parts

  • CNC machining parts

  • Stepping motors

  • Helical gears and worm gears

  • Lead screws

  • Photo etching components

  • LCD modules

  • PCB assemblies

  • Electronic components

  • Wafer substrate material

Engineering support for sourcing activities:

  • Specification and design for manufacturing review

  • Inspection method and tooling support

  • Surface treatment technical advice and inspection method

  • Reliability test and material analysis

  • Circuit design for electronic devices

  • Testing instruments development

Services

Design and Development

Product Expertise

  • Design for Test/Manufacturing/Assembly

  • In-house prototype builds

  • Performance and reliability testing

  • Regulatory certification

  • Technology selection and roadmaps

  • Cost/performance analysis

  • Test planning and procedure development

  • Failure analysis

  • Safety compliance

Embedded Systems

  • Sensors, actuators and control systems

  • Low power devices

  • Digital, analog and mixed signal circuits

  • Microcontrollers

  • Displays and indicators

PCB Design

  • PCB layout services

  • Digital and RF layout

  • DFM review and fabrication support

Mechanical Engineering

  • Mechanical product architecture

  • Electronics packaging

  • Complex injection-molded part design

  • Design for manufacturing and assembly

  • Risk identification and mitigation planning

  • Automation and robotics mechanism design

Manufacturing

Integrated manufacturing

  • Integrated with design, engineering, supply chain

  • Products that meet or exceed expectations

  • Early risk detection and mitigation

  • Access to designers and engineers

  • Real time monitoring

  • Innovation, continuous improvement

Products

Communication Network

Frequency Inverter

Telecommunication

Test equipment

Contacts

HARBIN BIMOTEK TECHNOLOGY CO. LTD Address: Special customs supervision zone,No.9, Huamao Avenue, Xiangfang District, Harbin City, Heilongjiang Province

Tel: +8613214602611

E-mail: b2b@harbinbimotek.com

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